- Code
- SilSo Bond 13622 Feature
- Feature 1
- Excellent flow and self levelling properties
- Feature 2
- Low corrosion
- Feature 3
- Good adhesion to substrates
- 100% Modulus (N/mm2)
- 0.32 MPa
- Appearance
- Viscous liquid
- Color
- Black
- Cure Profile
- 23+/-2°C and 50+/-5% humidity
- Cure Through to 3 mm Depth
- 24 hr
- Cure Type
- Oxime
- Density
- 1.05 g/cm3
- Dielectric Constant
- 2.6
- Dissipation Factor
- 0.001
- Elongation at Break
- 390 %
- Extrusion Rate g/min
- 860 g/min
- Hardness Shore A
- 24
- Linear Coefficient of Thermal Expansion (ppm/°C)
- 282 ppm/°C
- Linear Shrinkage (%)
- 1 %
- Max Storage Temperature
- 40 °C
- Max Working Temp
- 275 °C
- Min Working Temp
- -50 °C
- Rheology
- Flowable
- RTV or Heat cure
- RTV
- Shelf Life
- 12 mths
- Tack Free Time / Skin Formation at 23°C/73°F
- 13 min
- Tear Resistance (N/mm)
- 3.1 N/mm
- Tensile Strength
- 1.9 N/mm2
- Test Conditions
- 7 days at 23+/-2°C and 50+/-5% humidity
- Thermal Conductivity
- 0.2 W/mK
- Viscosity Mixed
- 23500 cP
- Volume Coefficient of Thermal Expansion (ppm/°C)
- 846 ppm/°C
- Volume Resistivity (Ohms cm)
- 1.00E+15 ohms cm
- Youngs Modulus (N/mm2)
- 0.55 N/mm2